微波组件芯片超声清洗工艺  

Ultrasonic Cleaning Process for Microwave Multi-Chip Module

作　　者：李惠[1] 崔洪波[1] 郭倩[1] 

机构地区：[1]中国电子科技集团公司第五十五研究所,江苏南京210016

出　　处：《电子工艺技术》2016年第4期217-219,238,共4页Electronics Process Technology

摘　　要：芯片焊接后超声清洗是微波组件组装过程至关重要的环节,超声清洗广泛用于军工、电子和机械领域,然而由于芯片十分脆弱,不恰当的超声清洗工艺容易造成芯片损伤或清洗效果的不理想。因此,针对这种不良现象,研究出优化的超声清洗工艺,通过试验阐述了影响清洗效果的几个因素,如强度、频率和温度等八方面,并提出了改进意见。Ultrasonic cleaning is one of the most important parts in MMCM assembly process. Ultrasonic cleaning is widely used in military, electronics, machinery fields. However, due to the chip is very fragile, do not appropriate for ultrasonic cleaning process easily lead to chip damage or cleaning effect. Therefore, study on optimization of ultrasonic cleaning process according to this undesirable phenomenon, through the experiment describe the influence of several factors such as strength, frequency, temperature and other factors on cleaning effect, and put forward the suggestions for improvement.

关 键 词：超声清洗 微波组件 芯片 残留物 

分 类 号：TN605[电子电信—电路与系统]