活化氢气氛下的无助焊剂焊接  

Fluxless Soldering in Activated Hydrogen Atmosphere

作　　者：C.Christine Dong Richard E.Patrick Russell A.Siminski Tim Bao 

机构地区：[1]Air Products and Chemicals,Allentown,PA 18195-1501,USA [2]Air Products and Chemicals,Shanghai 201203,China

出　　处：《电子工业专用设备》2016年第8期1-4,34,共5页Equipment for Electronic Products Manufacturing

摘　　要：介绍了一种新颖的基于电子附着(Electron Attachment,EA)原理的氢气活化技术,可以实现在大气压力和正常焊接温度下的无助焊剂焊接。该技术有望被应用于电子封装行业的诸多领域。A novel hydrogen activation technology based on electron attachment（EA） is developed for fluxless soldering at ambient pressure and normal soldering temperature.The technology has a potential to be used for a list of applications in the electronics packaging industry.

关 键 词：电子附着 活化氢 无助焊剂焊接 电子封装 氧化物去除 助焊剂残留 氢负离子 

分 类 号：TN405.98[电子电信—微电子学与固体电子学]