真空共晶焊接设备温度场设计及仿真优化  

The temperature field design and simulation optimization of vacuum eutectic welding equipment

作　　者：王成君[1] 王宏杰[1] 郭华锋[1] 王永卿[1] 

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《真空》2016年第4期75-78,共4页Vacuum

摘　　要：共晶焊接设备的温度均匀性直接决定焊接电子元器件的质量,因此设备的温度场设计成为共晶焊接设备的关键。本文首先设计了由加热元件(红外灯管)、热板、反射板和隔热板组成的加热组件;其次应用试验测试和有限元仿真相结合的方法,分别讨论了两组加热元件的排布方式对于热场温度均匀性的影响;最后采用真空共晶焊接设备验证了温度场设计的可行性。实验结果表明,采用加热元件变间距排布的方式,其温度场的均匀性能达到±5℃的要求,焊接电子元件的平均孔洞率和剪切强度分别达到了1.78%和9.8kg,符合了GJB 548B-2005对于电子元器件焊接质量的要求。The temperature uniformity of the eutectic welding equipment directly determines the quality of the electronic components,so the design of the temperature field is the key to the eutectic welding equipment. In this paper, heating component is designed, which includes heating element（infrared tubes）, hot plate, baffle plate and heat shield. The method of combining the finite element simulation with test is used to discuss the configuration of two groups of heating element for the influence on thermal field temperature uniformity.The experimental results show that the heating element with variable spacing arrangement way, the uniform performance of temperature field meet the requirements of ±5 ℃. The average hole rate and shear strength of the welding electronic components reached 1.78% and9.8 kg, meeting the requirement of GJB 548-2005.

关 键 词：共晶焊接 温度均匀性 热场仿真 空洞率 剪切强度 

分 类 号：TB79[一般工业技术—真空技术] TK11[动力工程及工程热物理—热能工程]