高功率LED散热技术研究进展  

Advancement on Thermal Enhancement for High Power LED

作　　者：曹玉春[1] 陈亚飞[1] 周慧慧[1] 陈其超[1] 

机构地区：[1]常州大学热能与动力工程系,江苏常州213016

出　　处：《光电子技术》2016年第2期111-116,共6页Optoelectronic Technology

基　　金：常州市自然科学基金资助(CJ20120024)

摘　　要：从高功率LED理论模型分析着手,分别从芯片级、封装级和系统级三个层面归纳和总结了LED热管理的最新研究进展。研究发现:芯片倒装结构及合理的阵列方式有利于散热;性能优良的封装材料和翅片的优化能有效降低热阻;选择适当的二次散热方式也是提高散热效率的关键。Theoretical model of high-power LED was analyzed in this paper, in which the lat est research progress of its thermal management were studied and summarized from the chip lev el, package level and system level, respectively. It was found that flip-chip structure and reason able placements were conducive to heat dissipation; the thermal resistance could be effectively re duced with excellent packaging materials and optimized fin size ; choosing the appropriate second ary heat dissipation way was also the key to improve the heat dissipation efficiency.

关 键 词：散热 高功率发光二极管 封装 热管理 

分 类 号：TN601[电子电信—电路与系统]