反应挤出法分离废弃电路板中焊锡的研究  

Separation of Tin from Waste Printed Circuit Board by Reactive Extrusion Method

作　　者：秦红[1] 吴海国[1] 张著[1] 李婕[1] 杨文[1] 谭令[1] 胡亮[1] 吴奂[1] 邓星桂 

机构地区：[1]湖南有色金属研究院,湖南长沙410100

出　　处：《湖南有色金属》2016年第4期36-39,共4页Hunan Nonferrous Metals

摘　　要：提出一种高效、清洁回收废弃电路板焊锡的工艺,探索了硫酸浓度、硫酸铜过量系数、螺杆转速、反应温度、反应时间和液固比对剥锡效果的影响,采用氧化水解法实现了铜、锡分离。优化得到较为适宜的浸锡工艺条件:硫酸浓度1.2 mol/L,硫酸铜过量系数1.2,螺杆转速75 r/min,反应温度50℃,反应时间2.5 h,液固比3∶1。在此优化条件下锡的浸出率达98.74%。采用氧化水解法进行铜、锡分离,锡的沉淀率可达96.3%,铜的损失率为0.37%。A simple, green, and energy-saving technique was developed to recycle Sn from the waste printed circuit board. The effects of H2SO4 concentration, CuSO4 excessing coefficient, screw rotating speed, leaching temperature, leaching time,liquid to solid ratio were investigated. The extraction percentage of Sn reaches 98.74%, under the condition with the effects of H2SO4 concentration of 1.2 mol/L, CuSO4 excessing coefficient of 1.2, screw rotating speed 75r/min, leaching temperature 120 ℃, leaching time 2.5 h and liquid to solid ratio of 3： 1. Selective oxidation-hydrolysis on the separation of copper and tin was studied, the deposition rate of tin reaches 96.3 %, but the copper is 0.37%.

关 键 词：焊锡 反应挤出法 硫酸铜 置换 

分 类 号：TF805.2[冶金工程—有色金属冶金]