低VOCs无卤素水基免清洗助焊剂的研制与应用  

Development and Application of Low VOCs Halogen-free Water-based No-clean Flux

作　　者：朱火清 曾燕 李世婕 

机构地区：[1]广东省焊接技术研究所(广东省中乌研究院),广东广州510650

出　　处：《广东化工》2016年第15期64-66,共3页Guangdong Chemical Industry

摘　　要：无卤素水基助焊剂普遍存在表面张力大,活性差,残留多以及易发霉等难题,文章通过对活性剂、助溶剂、缓蚀剂以及表面活性剂等组分的优化较好地解决了这些问题,研制了一种无卤素水基免清洗助焊剂NC902。经检测,该助焊剂的各项性能均达到国家相关助焊剂标准要求。助焊剂对无铅焊料Sn0.7Cu的平均铺展率达到80.75%。采用SAT-5100可焊性测试仪测试了该焊剂的润湿性能,结果显示零交时间为0.90秒,润湿时间为1.35秒,最大润湿力为3.47 m N,平均润湿角为25.60°。Halogen-free water-based flux has problems including high surface tension, poor activity, and multi residue and molding easily. In the paper, the problems have been solved through the optimization of active agent, cosolvent, corrosion inhibitor and surfactant. A halogen-free water-based no-clean flux NC902 has been developed. The performance of the flux has met the national standard on flux requirements. The average spreading rate reached 80.75 % for Sn0.7Cu lead-free solder. Wetting performance is measured by solderability tester SAT-5100. The results showed a zero-crossing time of 0.90 seconds, wetting time of 1.35 seconds, maximum wetting force 3.47 mN and average wetting angle of 25.6℃.

关 键 词：无VOCs 无卤素 免清洗助焊剂 无铅焊料 波峰焊 

分 类 号：TG425.1[金属学及工艺—焊接]