金属与玻璃封装集成电路小漏率检测技术研究  

Research on the Detecting Techniques of the Small Leak Rate of Metal and Glass Package Integrated Circuit

作　　者：卢思佳[1] 

机构地区：[1]工业和信息化部电子第五研究所,广东广州510610

出　　处：《电子产品可靠性与环境试验》2016年第4期39-43,共5页Electronic Product Reliability and Environmental Testing

摘　　要：对金属-玻璃封装集成电路的小漏率检测技术进行了研究。首先,介绍了充压式氦质谱检漏法、破坏性内部气氛含量分析法和累积型氦检漏法的原理和流程;然后,分别利用这3种方法,对某试验样品的小漏率进行了检测;最后,根据试验结果,对3种方法的优缺点和适用范围进行了总结,对于金属-玻璃封装集成电路的小漏率的检测方法的正确选择具有重要的指导意义。The detecting techniques integrated circuit are studied. Firstly, of the small leak rate of metal and glass package the principles and processes of pressure-filled helium mass spectrometer leak detection method, destructive internal gas content analysis method and accumulative helium leak detection method are introduced. And then, the small leak rate of some test samples are detected through the three methods. Finally, based on the test results, the advantages and disadvantages of the three methods as well as their application scope are summarized, which has important guiding significance for the correct selection of the detection method of the small leak rate of metal and glass package integrated circuit.

关 键 词：集成电路 小漏率 检测技术 

分 类 号：TN407[电子电信—微电子学与固体电子学]