氰化物镀铜的影响因素及其常见杂质的去除方法  

Factors affecting cyanide copper electroplating and methods for removing common impurities

作　　者：朱卓敏 王宗雄 储荣邦 

机构地区：[1]义乌市都得益电镀材料商行,浙江义乌322000 [2]宁波市电镀行业协会,浙江宁波315199 [3]江苏南京210013

出　　处：《电镀与涂饰》2016年第15期812-816,共5页Electroplating & Finishing

摘　　要：阐述了影响氰化镀铜工艺和镀层质量的各种因素,介绍了都得益的氰化物镀铜光亮剂、促进剂以及阳极极化剂、锌杂质容忍剂和专用油污处理剂的用法,给出了去除铅、锌、碳酸盐、六价铬等常见杂质和槽液大处理的方法。Various factors affecting the cyanide copper electroplating and coating quality were described. The usages of Dudeyi＇s brighteners, accelerators, anode polarizer, zinc-tolerating agent and oil remover for cyanide copper electroplating were introduced. The methods for removing some common impurities such as lead, zinc, carbonate and hexavalent chromium as well as big treatment of plating bath were presented.

关 键 词：氰化镀铜 添加剂 杂质 故障排除 

分 类 号：TQ153.14[化学工程—电化学工业]