木塑复合材料化学镀铜及其性能  

Electroless copper plating on wood–plastic composite and properties of coating

作　　者：陈晖[1] 孙宇[1] 李健[1] 郭艳玲[1] 

机构地区：[1]东北林业大学机电工程学院,黑龙江哈尔滨150040

出　　处：《电镀与涂饰》2016年第16期850-852,885,共3页Electroplating & Finishing

基　　金：中央高校基本科研业务费专项资金(2572015BB05);国家自然科学基金项目(51075067);高等学校博士学科点专项科研基金资助课题(博导类)(20130062110006);中国博士后基金项目(2015M571382)

摘　　要：对采用选择性激光烧结法制备的木塑复合材料依次进行渗蜡、打磨、碱性高锰酸钾溶液粗化和银氨溶液活化后再化学镀铜。化学镀铜配方和工艺条件为:CuSO_4·5H_2O 15 g/L,37%(质量分数)甲醛15 mL/L,酒石酸钾钠15 g/L,乙二胺四乙酸二钠20 g/L,亚铁氰化钾0.01 g/L,NaOH适量,pH 11.5~12.0,装载量3 dm^2/L,温度50°C,时间20 min。所得铜镀层均匀、致密,有金属质感,厚度为2.49μm,结合力为1级,表面电阻为0.597Ω。Electroless copper plating was conducted on wood-plastic composite prepared by selective laser sintering after pretreatments of wax infiltration, polishing, roughening in alkaline potassium permanganate bath and activation with silver ammonia solution successively. The bath composition and process conditions for electroless copper plating are as follows： CuSO4.5H2O 15 g/L, 37wt% methanol 15 mL/L, potassium sodium tartrate 15 g/L, disodium ethylenediaminetetraacetate 20 g/L, potassium ferrocyanide 0.01 g/L, NaOH as required, temperature 50 ℃, pH 11.5-12.0, loading capacity 3 dm^2/L, and time 20 min. The copper coating obtained is uniform, compact and metallic with a thickness of 2.49μm, a 1-grade adhesion strength, and a surface resistance of 0.597 Ω.

关 键 词：木塑复合材料 银氨溶液活化 化学镀铜 表面电阻 结合力 

分 类 号：TQ153.14[化学工程—电化学工业] TB332[一般工业技术—材料科学与工程]