铜粉电子浆料的老化性能  

Aging Properties of Low Copper Electronic Pastes

作　　者：边慧[1] 苏晓磊[1] 李冰[1] 王俊勃[1] 

机构地区：[1]西安工程大学机电工程学院,陕西西安710048

出　　处：《材料科学与工程学报》2016年第4期619-623,666,共6页Journal of Materials Science and Engineering

基　　金：陕西省教育厅自然专项资助项目(15JK1314);陕西省产业用纺织品协同创新中心科研资助项目(2015ZX-27);纺织工业联合会科技指导性计划资助项目(2014005);西安工程大学机械工程学科建设资助项目

摘　　要：为了研究铜电子浆料的老化性能,本文以铜粉、环氧树脂、固化剂及偶联剂为原料,采用共混法制备了低温固化类铜粉电子浆料,借助XRD、SEM和LCR数字电桥对其进行表征和性能测定。结果表明:经偶联剂包覆处理后铜粉的分散性得到提高,导电浆料在自然老化条件下放置180天时电阻值最大为33.8Ω,室温氧化60天后质量仅增重1.32%×10-3。因此,制备的低温铜粉电子浆料具有较好的热稳定性、抗氧化性及可靠性。With the aim of the study of aging performances of copper electronic paste, the low temperature curing copper electronic pastes have been prepared by the blending method using copper powder, epoxy resin, curing agent, and coupling agent as the raw materials, respectively. The prepared copper pastes have been characterized by XRD, SEM and LCR, respectively. The effects of aging on property of pastes have been studied. Results showed that the dispersion property of copper powders treated by the coupling agent has been improved. The maximum resistance value of electronic pastes under the natural aging conditions for 180 days was 33. 812 and the oxidation weight has been increased by only 1.32% ×10^-3 in the oxidation for 60 days at room temperature. The prepared low temperature copper electronic pastes possesse good reliability, high oxidation resistance and thermal stability, respectively.

关 键 词：电子浆料 抗氧化性 稳定性 铜粉 

分 类 号：TM241[一般工业技术—材料科学与工程]