电子产品故障的印制板缺陷排查方法  

PCB defect inspection method for electronic products

作　　者：邬宁彪[1] 刘立国[1] 

机构地区：[1]江南计算技术研究所,江苏无锡214083

出　　处：《印制电路信息》2016年第9期56-60,共5页Printed Circuit Information

摘　　要：文章介绍了因印制板镀覆孔断裂、孔偏位、绝缘劣化缺陷造成的电子产品故障的相关检测技术和分析方法,并通过经验总结归纳了印制板缺陷的失效分析方法,为电子工程师排查电子产品故障提供了新的思路。This paper is introduced the correlation detection technique and analysis method for the fault of the electronic product in printed circuit board plating hole fracture and hole deviation, as well as insulation deterioration defects. By experience of failure analysis method summarized for the printed circuit board defect, it provides a new idea for the electronic engineer investigation to the fault of the electronic product.

关 键 词：失效分析 孔壁断裂 金相切片 离子迁移 

分 类 号：TN41[电子电信—微电子学与固体电子学]