超薄不锈钢基板CMP抛光头的改进  

Improvement of CMP Polishing Head for Ultra-Thin Stainless Steel Substrate

作　　者：袁文强[1] 魏昕[1] 谢小柱[1] 胡伟[1] 

机构地区：[1]广东工业大学机电工程学院,广东广州510006

出　　处：《机械设计与制造》2016年第9期143-146,共4页Machinery Design & Manufacture

基　　金：国家自然科学基金项目(51175092);教育部高校博士学科专项科研基金项目(20104420110002);广东省自然科学基金项目(10151009001000036);广东省科技计划项目促进科技服务业发展专项计划(2010A040203002);广东省科技计划项目(2011B010600043)

摘　　要：介绍了化学机械抛光过程中传统的工件夹持方式,针对传统夹持方式在夹持超薄不锈钢基板等柔性工件时存在的缺点,设计了一种新的CMP抛光头,该抛光头采用真空吸盘吸附工件。同时设计了相应的真空气路系统,保证抛光头响应速度和对工件夹持的可靠性。通过ABAQUS软件分析了超薄不锈钢基板在抛光过程中的变形及其与抛光垫之间的接触压力,得到真空吸盘的合理结构。最后采用改进后的抛光头进行不锈钢基板抛光实验,并对比基板抛光前后表面质量验证抛光头的有效性。The traditional clamping ways of workpieces in the chemical mechanical polishing process were introduced And a new kind of CMP polishing head which adopted the vacuum sucker to adsorb workpieces was designed, in view of the disadvantages of traditional clamping ways in clamping flexible workpieces such as ultra-thin stainless steel substrates. Meanwhile, the vacuum system was designed to ensure the response speed and reliability of this polishing head clamping workpieces. What＇s more, the deformation and contact pressure with polishing pad of ultra-thin stainless steel substrate in the polishing pracess were analyzed by ABAQUS, and the rational structure of the vacuum sucker had been gained Finally chemical mechanical polishing experiments for stainless steel substrate was carried out using this improved polishing head, and the validity of this polishing head was verified via comparison between the surface quality of substrate before polishing and after.

关 键 词：化学机械抛光 夹持方式 超薄不锈钢基板 

分 类 号：TH16[机械工程—机械制造及自动化] TG75[金属学及工艺—刀具与模具]