一种控制SoC芯片封装的多物理域设计仿真分析研究  

Multiple Physical Domain Simulation Analysis and Design for Controlling SoC Chip Package

作　　者：马晓波 王蒙 张兵 谢建友 谢天禹 王昕捷 

机构地区：[1]华天科技(西安)有限公司,陕西省西安市710000 [2]全球能源互联网研究院,北京市昌平区102209

出　　处：《智能电网》2016年第8期767-771,共5页Smart Grid

基　　金：国家电网公司科技项目(SGRIDGKJ[2013]209号)~~

摘　　要：伴随着电子集成电路产业的迅猛发展,芯片封装仿真模拟等手段不断提升,越来越多的性能仿真分析技术正逐步渗透到芯片封装技术的制造过程,仿真技术在保证封装的各项可靠性及产品性能的同时,省去了大量的封装实验验证批次,大大缩短设计和制造周期。通过对一种SoC芯片封装的电、热及应力性能的多物理域设计仿真分析,介绍如何使用仿真分析方法对SoC芯片封装的性能进行研究。Along with the rapid development of electronic integrated circuit industry, means such as chip package simulation etc. continuously upgrade, and more and more performance simulation analysis technology is gradually infiltrated into the manufacturing process of chip packaging technology. Simulation technology ensures the reliability of the package and product performance, meanwhile, it also eliminates the need for a large number of experiments to verify the package, which greatly shortens the design and manufacturing cycle. In this paper, a multiple physical domain simulation analysis on the electrical, thermal and stress performance of a SoC chip package is presented, and how to use the simulation analysis method to study the performance of the SoC chip package is presented.

关 键 词：SoC芯片封装 封装设计 多域仿真 

分 类 号：TN47[电子电信—微电子学与固体电子学]