选择性波峰焊工艺研究要点  

Research on Selective Wave Soldering Process

作　　者：黄明辉[1] 汤春江[1] 刘涛[1] 

机构地区：[1]中国电子科技集团公司第四十三研究所,合肥230088

出　　处：《混合微电子技术》2016年第2期45-49,共5页Hybrid Microelectronics Technology

摘　　要：本文阐述了选择性波峰焊技术的特点，并研究了选择性波峰焊的主要工艺参数。选择了试验板进行焊接，并通过正交试验法优化焊接工艺参数，可以有效避免焊点桥连、拉尖等缺陷的产生，对焊点进行x-ay检查，焊点透锡良好。This article describes the characteristic of selective wave soldering process and studies the main process parame- ters. The soldering defects such as bridges and sharps can be avoided by optimizing the process parameters by DOE. The solder joints of the experimented printed board are inspected by X - RAY. The result shows that the solder filled in the hole, and the solder fillet is formed on the both sides of the PCB.

关 键 词：选择性波峰焊 工艺参数 正交试验 X—RAY 

分 类 号：TG441.4[金属学及工艺—焊接]