微孔和杂质对拉制铜线断裂的影响  

Influence of Micro-pores and Impurities on Drawing Copper Wire Fracture

作　　者：吴恺威 邓沛然[1] 翟靖[1] 张涛[1] WU Kaiwei DENG Peiran ZHAI Jing ZHANG Tao(School of Materials Engineering, Shanghai University of Engineering Science, Shanghai 201620, China)

机构地区：[1]上海工程技术大学材料工程学院,上海201620

出　　处：《热加工工艺》2016年第19期259-261,共3页Hot Working Technology

基　　金：上海工程技术大学研究生科研创新资助项目(14KY0522)

摘　　要：对拉制过程中铜丝断口运用扫描电镜和能谱进行了观察与分析。结果表明:在断口处存在微孔和夹杂物,其所在区域在铜线拉丝时会成为裂纹最先发展的区域,并导致铜丝断裂。因而提高铜棒原材料的冶金质量,完全消除熔炼制棒过程杂质的渗入是提高铜丝拉制质量和成品率的关键。The fracture of copper wires in the drawing process was observed and analysed by using scanning electron microscope and energy spectrum. The results show that： there are micro-holes and inclusions in the fracture, and the region will become the first area of crack development in the process, which finally leads to wire fracture. Thus, improving the metallurgical quality of copper raw materials and complete elimination of impurities in the process of melting are the key to improve the quality and the finished products rate of copper wire drawing.

关 键 词：断口 扫描电镜 能谱 夹杂物 

分 类 号：TG359[金属学及工艺—金属压力加工] TG146.1[一般工业技术—材料科学与工程]