基于SMT的印制板可焊性不良工艺技术研究  

Research on Poor Solderability based on the SMT Process Technology

作　　者：孙亚芬[1] 安平[1] 

机构地区：[1]西安北方光电科技防务有限公司,陕西西安710043

出　　处：《新技术新工艺》2016年第10期79-81,共3页New Technology & New Process

摘　　要：影响印制板可焊性的因素比较多,各种工艺流程比较复杂,批量印制板整体质量控制有一定的难度。通过对生产过程中的流程梳理和分析,并结合检验及试验验证,对引起印制板可焊性不良的原因进行了排查、分析和定位。该分析方法对于类似质量问题的排查具有一定的借鉴和指导意义。There are more factors influencing the solderability of the PCB, and various technological process is very complex. It is difficult to control the overall quality of the PCB. Through combing and analyzing the production process, and combined with the test and verification, the quality problem of poor solderability is located. The methods have certain consulted value and reference significance to the quality problem analysis.

关 键 词：印制电路板 表面组装技术 可焊性 可焊性试验 

分 类 号：TN05[电子电信—物理电子学]