制备电泵硅基混合激光器的选区金属键合方法  

A selective area metal bonding method for electrically pumped silicon-based hybrid lasers

作　　者：李艳平[1] 陶利[1] 冉广照[1] 陈娓兮[1] 

机构地区：[1]北京大学物理学院,北京100871

出　　处：《实验技术与管理》2016年第10期49-54,共6页Experimental Technology and Management

基　　金：国家自然科学基金项目(61404003;11174018);国家基础研究项目(2013CB632105;2013CB921901)资助

摘　　要：为了解决制约硅基光电集成技术发展的硅基激光器等硅基光源的制备问题,提出了一种新颖的选区金属键合方法,解决了传统金属键合方法中光吸收损耗严重的问题,并实现了直接键合方法中的高效率光耦合。该方法具有工艺简单,环境要求低,电、热和机械性能优越,键合温度低、时间短,能够有选择性地将很小的单元结构键合到硅基芯片上等优点。该方法也可用于键合光探测器和光放大器等其他分立器件。For the fabrication of silicon-based lasers, which restricts the development of silicon-based optoelectronic integrated technology,a new method of selective area metal bonding is proposed, which solves the problem of the optical absorption loss in the traditional metal bonding method, and realizes the high efficiency optical coupling in the direct bonding method. This method has advantages of simple process,low requirement for environment,excellent electrical,thermal and mechanical properties,low bonding temperature and short bonding time, as well as can selectively be bonded to silicon based chip with little unit structure. In addition,the method can also be used for bonding optical detectors and optical amplifiers and so on.

关 键 词：硅基激光 选区金属键合 Ⅲ-Ⅴ族材料 光互连 

分 类 号：TN248[电子电信—物理电子学]