基于AC 110 V LED芯片制备立体发光灯片研究  

Research on Three-dimensional Light-emitting Chip Based on AC 110 V LED

作　　者：庄允益 王勇[1] 李占国[1] 李文博 王艺燃 杨磊 邹军[2] 

机构地区：[1]长春理工大学高功率半导体激光国家重点实验室,吉林长春130022 [2]上海应用技术学院理学院,上海201418 [3]浙江亿米光电科技有限公司,浙江嘉兴314100

出　　处：《光电子技术》2016年第3期150-154,共5页Optoelectronic Technology

基　　金：国家自然基金青年基金(No.51302171);国家自然基金(No.11474036);上海市自然科学基金(No.12ZR1430900);上海应用技术学院人才计划(No.YJ2014-04);上海市学科能力建设项目(No.14500503300);上海市产学研合作项目(No.沪CXY-2013-61);上海联盟计划项目(No.Lm201547)资助

摘　　要：基于交流(AC)110V发光二极管(LED)芯片制备了立体发光灯片,并对AC LED的光学均匀性和热学均匀性进行研究。通过改变荧光粉胶的配比来提高正反面的光学均匀性,研究发现,当立体灯片反面的荧光粉胶与正面的比例达到30%时,立体发光灯片反面的光通量与正面的比值最大,且正反面的色温差最小,其荧光粉的激发是最好的。另外,测试4种样品的发光角度,发现其发光角度分布相似,而发光强度与积分球测试得到的光通量比值也相近。同时对热学均匀性进行研究,发现正反面荧光粉胶配比达到30%时,该立体灯片的稳态温度最低,转化的热量最小,其相对应的光通量最高,使得立体灯片的热学均匀性更好。The three-dimensional（3D）light emitting chip was fabricated based on alternating current（AC）110Vlight emitting diode（LED）,and the optical and thermal uniformity of AC LED was studied.The optical uniformity of LED at front and back sides was improved by changing the mixing ratio of phosphor powder.When the ratio of phosphor powder glue between back-side and front-side is 30%,the ratio of luminous flux between back-side and front-side is the largest,and the difference of color temperature is the smallest,which indicates the excitation of phosphor powder is the best.In addition,it is found that 4kinds of samples have the similar light emitting angle distribution.Furthermore,the luminous intensity ratios of samples are similar to the flux ratios tested by the integral ball measurement.For the thermal uniformity,it is found that when the ratio of phosphor powder glue between back-side and front-side is 30%,the steadystate temperature of 3Dlight emitting chip is the lowest,the converting heat the smallest,and corresponding luminous flux the highest,indicating the best thermal uniformity of 3Dlight emitting chip.

关 键 词：交流发光二极管 立体发光 光学 热学 光通量 均匀性 

分 类 号：TN383.1[电子电信—物理电子学]