微量Ni对Sn/Cu界面组织形貌及柯氏孔洞形成的影响  

Effect of minor Ni addition on the microstructure and Kirkendall void formation at Sn/Cu interface

作　　者：杨扬[1] 温贻芳[1] 余春[2] 

机构地区：[1]苏州工业职业技术学院机电工程系,215104 [2]上海交通大学材料科学与工程学院,200240

出　　处：《焊接》2016年第11期19-22,72,共4页Welding & Joining

基　　金：国家自然科学基金项目(51105251);江苏省自然科学基金项目(BK20161228)

摘　　要：通过对反应界面微观组织形貌的表征分析,系统研究了热老化条件下微量Ni元素对Snx Ni/Cu(x的质量分数为0,0.05%,0.10%)的界面组织形貌演变及柯肯达尔孔洞形成的影响。结果表明,相对于Sn/Cu界面,添加的Ni元素大幅加速了Snx Ni/Cu界面(Cu,Ni)_6Sn_5层的生长,但显著阻缓了(Cu,Ni)_3Sn层的形成,有效抑制了柯肯达尔孔洞的形成。(Cu,Ni)_6Sn_5层由多层细小晶粒组成,这种多晶界结构有利于界面组分元素的互扩散,可缓解Cu和Sn的不平衡扩散;薄的(Cu,Ni)_3Sn层限制了孔洞的形成空间,从而进一步抑制孔洞的形成。The effects of minor Ni addition on the evolution of microstructure and formation of Kirkendall voids at Snx Ni / Cu interface( x = 0,0. 05,0. 1 wt. %) under thermal aging were systemically studied through the characterization analysis of interfacial microstructure. The results indicated that comparing with the morphology at Sn/Cu interface,the addition of minor Ni dramatically accelerated the growth of( Cu,Ni)_6Sn_5 layer at Snx Ni / Cu interface,while inhibited the formation of(Cu,Ni)_3Sn layer and Kirkendall voids effectively.( Cu,Ni)_6Sn_5 layer consisted of multi-layer small-sized grains. This kind of structure had plenty of grain boundaries,which was helpful for the interdiffusion of interfacial component elements,and could relieve the unbalanced diffusion. The thin( Cu,Ni)_3Sn layer restricted the formation space of voids,and inhibited the formation of voids furtherly.

关 键 词：界面 柯肯达尔孔洞 合金元素 金属间化合物 

分 类 号：G425.1[文化科学—课程与教学论]