CE/nano-SiO_2覆铜板的热压工艺研究  

Study on Hot Pressing Technology of CE/nano-SiO_2 Copper Clad Laminate

作　　者：张文根[1] 张学英[1] 

机构地区：[1]渭南师范学院化学与材料学院,陕西渭南714099

出　　处：《渭南师范学院学报》2016年第24期21-24,共4页Journal of Weinan Normal University

基　　金：陕西省科技计划项目:氰酸酯基高频印制电路基板的生产技术研究(2010K06-07);渭南师范学院科研计划项目:CEN-PCB基板的应用开发研究(14YKS002);渭南师范学院特色学科建设项目:秦东化工;材料技术调查(14TSXK04)

摘　　要：基于覆铜板高温高频化的发展方向,以高性能双酚A型氰酸酯树脂(CE)掺杂纳米二氧化硅(nano-SiO_2)配制胶液浸润玻璃布制成黏结片,将黏结片与铜箔叠合经过热压成型制造CE/nano-SiO_2覆铜板,通过测定覆铜板的剥离强度探讨其热压成型过程中的工艺条件。结果表明,200℃时固化时间为40min,220℃时后固化时间为120 min,固化和后固化时压力保持8 MPa为宜。The copper clad laminate （CCL） is to the direction of high temperature and high frequency. The bonding sheet was made by the glue of CE/nano-SiO2 composites infiltrating into E-glass cloth. The CCL of CE/nano-SiO2 was composed of bonding sheet and copper foil laminated molded by hot pressing. The hot pressing technology for CCL manufacturing process was investigated through measuring the peel strength of the copper clad laminate. The results showed that the curing time is 40 min at 200℃ and the post cure time is 120 min at 220℃,and the pressure remains 8 MPa when the curing and post curing.

关 键 词：氰酸酯树脂 NANO-SIO2 覆铜板 热压工艺 

分 类 号：TB332[一般工业技术—材料科学与工程]