薄壁铜件镍镀层返黑点原因分析与工艺优化  

Causes Analysis of Black-spot and Process Optimization on Nickel Electroplating of Thin-wall Copper Parts

作　　者：韩彦彬[1] 吴志勇[1] 杜东兴[1] 唐作琴[1] 邓三平[1] 

机构地区：[1]中国工程物理研究院机械制造工艺研究所,四川绵阳621999

出　　处：《电镀与精饰》2016年第12期29-31,36,共4页Plating & Finishing

摘　　要：针对薄壁铜件电镀镍后存放一段时间出现的镍镀层表面返黑点问题,利用优化电镀工装、优化电镀工艺流程等对镀镍工艺进行优化。采用盐雾腐蚀试验、孔隙率测试以及环境试验等方法对镀镍层性能进行评价。研究结果表明,工装优化后的镀层厚度均匀性有所提高,有利于提高生产效率和镀层质量;工艺优化后的镀镍层孔隙率明显降低、耐蚀性能明显提升,无返黑点现象。The black-spot problem of nickel electroplating on the thin-wall copper parts,which occurred after storing in a period of time,was investigated in this paper by the optimization of plating tooling and plating process,so as to optimize the nickel electroplating technology. The performance of the nickel plate was evaluated by the salt fog corrosion test,porosity test and environmental test. The results showed that the coating thickness uniformity of thin-walled copper parts was improved after optimization,which was conducive to the improvement of the production efficiency and the quality of the coating. The porosity decreased and corrosion resistance improved significantly,after the process optimization of nickel electroplating on thin-wall copper parts,and there was no black spots phenomena on the surface of the electroplating nickel.

关 键 词：薄壁铜件 电镀镍 返黑点 耐蚀 工艺优化 

分 类 号：TQ153.12[化学工程—电化学工业]