烘烤对塑封QFN器件纯锡镀层可焊性影响  

Effect of Baking QFN Device on Solderability of Pure Tin Plating

作　　者：孙晓伟[1] 程明生[1] 邹嘉佳[1] 蒋健乾[1] SUN Xiao-wei CHENG Ming-sheng ZOU Jia-jia JIANG Jian-qian(No.38 Research Institute of CETC, Hefei 230031, China)

机构地区：[1]中国电子科技集团公司第三十八研究所,安徽合肥230031

出　　处：《电子工艺技术》2016年第6期330-332,352,共4页Electronics Process Technology

基　　金：国防基础科研基金项目(项目编号:A1120132016)

摘　　要：纯Sn塑封QFN器件因其易吸潮和易氧化的工艺特性,成为困扰高可靠电子产品组装的一个问题,特别是焊前烘烤对器件可焊性的影响亟需评估。针对某纯Sn塑封QFN器件,开展不同烘烤条件下器件的可焊性测试和耐焊接热等试验,并通过质量分析手段评估组装后PCBA上元器件的焊接质量,从而为纯锡塑封QFN器件烘烤条件提供参考依据。Plastic QFN device with pure tin plating has become a focus in high reliability electronic products assembly, because of it＇s easy to absorb moisture and be easily oxidized during assembly. So the impact of baking before soldering on the solderability of QFN device must be evaluated. Taken a QFN device as example, carried out solderability test and resistance to soldering heat test under different baking conditions, and evaluated the soldering quality of the QFN device assembled on PCBA by quality analysis tools. Hope to provide some references for baking conditions of pure tin plating QFN device.

关 键 词：纯锡镀层 塑封 烘烤 可焊性 

分 类 号：TN605[电子电信—电路与系统]