粘接技术在军用电子设备上的应用  

Application of Bonding Technology in Military Electronic Equipment

作　　者：杨伟[1] 钟付先[1] 李建平[1] 毛久兵[1] YANG Wei ZHONG Fu-xian LI Jian-ping MAO Jiu-bing(The 30th Research Institute of CETC, Chengdu 610041, China)

机构地区：[1]中国电子科技集团公司第三十研究所,四川成都610041

出　　处：《电子工艺技术》2016年第6期360-363,共4页Electronics Process Technology

摘　　要：从粘接技术的应用出发,重点阐述了粘接技术在军用电子设备上的应用。讨论了粘接剂的选择依据,详细介绍了通用粘接工艺和一种各向异性导电胶的工艺应用研究过程。最后探讨了军用电子设备粘接技术的发展方向。The applications of the adhesive bonding technology was firstly described, and then the applications in the military field were intensively expound. The selection basis and principle for the adhesive were also discussed. The general bonding process and an application of anisotropic conductive adhesive technology process were detailed introduced. Finally, the development trends of the bonding technology in military electronic products were investigated.

关 键 词：粘接 军用电子设备 各向异性导电胶 

分 类 号：TG49[金属学及工艺—焊接]