粘接促进剂对环氧模塑料粘结力和分层的影响  

Studies of Effect of Adhesion Promoter on Epoxy Molding Compound

作　　者：秦旺洋 张高文[1] 丁全青 QIN Wangyang ZHANG Gaowen DING Quanqing(College of Materials and Chemicals Engineering, Hubei University of Technology, Wuhan 430068,China Henkel Huawei Electronic Co.,Ltd., Lianyungang 222006, China)

机构地区：[1]湖北工业大学材料与化学工程学院,武汉430068 [2]汉高华威电子有限公司,江苏连云港222006

出　　处：《电子与封装》2016年第12期6-11,共6页Electronics & Packaging

摘　　要：合适的粘接促进剂有助于提高环氧模塑料(EMC)与金属基材的粘接性能,进而改善EMC与金属基材的分层问题,提高封装的可靠性。主要讨论了3类粘接促进剂的作用机理,通过试样的抗拉测试、抗剪测试、超声波扫描分层测试,分别验证了环氧基硅烷偶联剂、氨基硅烷偶联剂、钛酸酯偶联剂、氨基咪唑4种粘接促进剂对EMC的粘结力和分层的影响。这4种粘接促进剂都能在不同程度上提高EMC对裸Cu和镀Ag引线框架的粘结力,氨基咪唑改善EMC对镀Ni引线框架的粘结力和分层的效果最好。Proper adhesion promoter effectively increases the adhesion performance of epoxy mold compound and improves the delamination of epoxy mold compound on metal substrate and reliability. In the paper, the mechanisms of three kinds of adhesion promoters are discussed. Adhesion is tested by Pull and Shear tests, and delamination is tested by Ultrasonic Scanning test. Effects of four adhesion promoters, of the three kinds mentioned above, on adhesion and delamination performance of epoxy mold compound are researched. The four adhesion promoters all increases adhesion of epoxy mold compound on Cu and Ag.Amino imidazole is the best to improve the adhesion and delamination on Ni.

关 键 词：粘接促进剂 环氧模塑料 粘结力 分层 

分 类 号：TN305.94[电子电信—物理电子学]