引线框架铜带性能与工艺分析  

Analysis on Performance and Process of Lead Frame Copper Strip

作　　者：田军涛[1] 

机构地区：[1]中国瑞林工程技术有限公司,江西南昌330031

出　　处：《有色冶金设计与研究》2016年第6期27-29,39,共4页Nonferrous Metals Engineering & Research

摘　　要：铜基引线框架合金材料是半导体元器件和集成电路封装的主要材料之一,其主要功能为散热、连接电路、机械支撑等。介绍了电子封装铜合金引线框架材料的分类,详细分析了集成电路对引线框架材料的技术要求及生产工艺条件,论述了我国铜基引线框架材料今后的发展方向。Copper-based lead frame alloy material is one of the main materials of semiconductor components and integrated circuit packaging, and its main functions are heat dissipation, circuit connection and mechanical support and so on. The paper introduces the classification of electrically packaged copper alloy lead frame material, analyzes the technical requirement and production process condition of integrated circuit to lead frame materials in details, and discusses the future development direction of copper-based lead frame material in our country.

关 键 词：引线框架铜带 半导体元器件 集成电路 性能 生产工艺 

分 类 号：TG146.11[一般工业技术—材料科学与工程]