光互连模块关键位置焊后对准偏移分析  

Study on Optical Interconnect Module Key Position Alignment Offset Post Welding

作　　者：邵良滨 黄春跃[1] 黄伟[1] 梁颖[2] 李天明[3] 

机构地区：[1]桂林电子科技大学机电工程学院,桂林541004 [2]成都航空职业技术学院电子工程系,成都610021 [3]桂林航天工业学院汽车与动力工程系,桂林541004

出　　处：《中国电子科学研究院学报》2016年第6期672-676,共5页Journal of China Academy of Electronics and Information Technology

基　　金：国家自然科学基金资助项目(51465012);广西壮族自治区自然科学基金资助项目(2015GXNSFCA139006)

摘　　要：建立了光互连模块三维有限元分析模型,对其进行了再流焊温度载荷下的有限元分析,获取了光互连模块关键位置处垂直腔面发射激光器(VCSEL,Vertical Cavity Surface Emitting Laser)发光中心点与耦合元件耦合中心点间的焊后对准偏移值;对光互连模块关键位置焊后对准偏移影响因子进行单因子分析,结果表明:所选取的焊球材料中,焊料63Sn37Pb对应的光互连模块关键位置焊后对准偏移值最小;所选取的焊球体积范围内,随着焊球体积增加,光互连模块关键位置焊后对准偏移逐渐增大。The 3D finite element analysis model of optical interconnect module was developed. The opti- cal interconnect module key position alignment offsets of luminous center point on vertical cavity surface emitting laser （VCSEL） and coupling center point on coupling element were obtained after finite elements analysis under reflow soldering temperature load; The factors which afeected optical interconnect module key position alignment offset were analysed, the results showed that： In the selected solder ball materials, optical interconnect module key position alignment offset post welding of solder ball material 63Sn37Pb was minimum; In the selected solder ball volume range, with the increase of solder ball volume, optical interconnect module key position alignment offset post welding increased gradually.

关 键 词：光互连模块 关键位置 再流焊接 对准偏移 有限元分析 

分 类 号：TN256[电子电信—物理电子学]