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机构地区:[1]九江学院机械与材料工程学院,江西九江332005 [2]九江学院江西省表面绿色再制造工程技术中心,江西九江332005
出 处:《模具工业》2017年第1期10-13,共4页Die & Mould Industry
基 金:国家自然基金项目(5156050036);九江学院校级科研课题研究项目(2014KJYB015)
摘 要:利用Moldflow软件,结合正交方法和方差及显著性分析,研究了模具温度、熔体温度、保压时间和冷却时间对以结晶型聚合物为材料的手机后盖型腔残留应力的影响。模拟结果表明:塑件厚度方向上的型腔残留应力为拉应力。试验发现对结晶型聚合物塑件,模具温度对结晶型聚合物塑件的型腔残留应力影响显著,其余因素对塑件的型腔残留应力影响不大,原因在于模具温度影响了结晶型聚合物塑件的结晶过程,使得塑件在冷却过程中的应力得以释放。经正交法优化后的工艺参数为:模具温度20℃、冷却时间10 s、熔体温度220℃、保压时间20 s,优化后的型腔残留应力为21.80 MPa,较优化前降低了15.8%。The effects of mould temperature, melt temperature, pressure holding time and cooling time on in-cavity residual stress of mobile phone back cover that was made from crystalline polymer were analyzed by using Moldflow software and combining with orthogonal method and variance and significant analysis. The simulation results showed that the cavity residual stress of part on the direction of the thickness was tensile stress. For crysalline polymer plastics, the mould temperature has a significant influence on in-cavity residual stress, the rest of the factors have a little influence on it. The reason was that the mould temperature affects on the crystallization process of polymer plastics, the stress of plastics in the cooling process was released. Process parameters were optimized by orthogonal method, namely, the mould temperature was 20 ℃, cooling time was 10 s, the melt temperature was 220℃, the pressure holding time was 20 s. The optimized in-cavity residual stress was 21.80 MPa, which was reduced 15.8% than before.
关 键 词:薄壁塑件 正交法 型腔残留应力 Moldflow 模具温度 结晶型聚合物
分 类 号:TG76[金属学及工艺—刀具与模具] TP391[自动化与计算机技术—计算机应用技术]
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