一种基于板壳理论对芯片翘曲变形的研究  

A Predictive Model for Thermo-Mechanical Warpage of Micro-Electronic Packages

作　　者：郭威 王小龙 谢建友 张锐 GUO Wei WANG Xiaolong XIE Jianyou ZHANG Rui(HuaTian Technology （Xi＇an） Co. Ltd, Xi＇an 710018, China)

机构地区：[1]华天科技(西安)有限公司,西安710018

出　　处：《电子与封装》2017年第1期15-18,共4页Electronics & Packaging

摘　　要：在温度变化过程中,由于芯片封装层叠结构及材料热膨胀系数的不匹配,封装结构会发生翘曲现象。芯片翘曲关乎到电子元器件的可靠性及质量,准确快速地计算翘曲对于封装结构设计及材料选型有着重要意义。基于多层板翘曲理论,建立了一套对芯片翘曲进行计算的双曲率模型。以常规的指纹识别芯片为例,通过实验测量及有限元仿真的对比验证,证明了该理论可以满足工程计算精度。该模型可以拓展到其余多层板结构的翘曲计算,对于优化芯片翘曲设计有重要意义。The asymmetric structure and mismatch of coefficient of thermal expansion may lead to warpage of micro-electronic package due to the temperature change .The micro-electronic warpage may affect product reliability and quality. A fast predictive model for the package warpage is important for the design of package structure and material selection. The paper establishes a dual-curvature （DC） model to predicate the package warpage using the laminated theory. The samples are measured by Shadow moire and fiLrther verified by the finite element model. The experiment and simulation prove the accuracy of this model. In addition, this model can be further developed to predicate the warpage of other multi-layers structure, having a great potential for the package optimization.

关 键 词：芯片翘曲 有限元仿真 双曲率 

分 类 号：TN305.94[电子电信—物理电子学] TN403