厚铜板产品控制要求和难点  

Manufacture control requirements and difficulties for Heavy-Copper Clad Laminate

作　　者：任树元 王立峰[1] 肖逸兴[1] 张俊鹏[1] 

机构地区：[1]广东生益科技股份有限公司,广东东莞523039

出　　处：《印制电路信息》2017年第3期51-56,共6页Printed Circuit Information

摘　　要：厚铜板具有承载大电流、减少热应变和散热性良好的特性。文章从CCL厚铜板制作难点和注意事项、厚铜产品工程设计注意事项、厚铜产品PCB加工控制难点和注意事项及厚铜产品结构性问题四方面对厚铜板产品制作难点进行了分析汇总供大家共同探讨。The heavy-copper PCBs are applied to carry large current, reduce thermal strain and to promote heat dissipation. This article discusses the key processing difficulties of heavy-copper products in respects of heavy- copper CCL production difficulties, heavy-copper product engineering design, heavy-copper PCB processing difficulties and some structural problems related with heavy-copper products.

关 键 词：厚铜板 耐压 焊盘拉裂 工程设计 

分 类 号：TN41[电子电信—微电子学与固体电子学]