无氰镀银新工艺的研究  

Investigation of a New Cyanide-Free Silver Electroplating Process

作　　者：刘明星[1] 欧忠文[1] 胡国辉 聂亚林 缪建峰[4] 

机构地区：[1]后勤工程学院化学与材料工程系 [2]重庆立道表面技术有限公司 [3]哈密军分区69330部队 [4]73206部队

出　　处：《电镀与精饰》2017年第3期13-18,共6页Plating & Finishing

摘　　要：介绍了一种可以产业化应用的无氰镀银新工艺。采用多种测试及表征方法,对镀液稳定性、分散能力及深镀能力等性能进行了测定;对无氰银镀层的外观质量、微观形貌、结合力、可焊性、抗变色性能及导电性等性能与氰化镀银层进行了对比分析。结果表明,无氰镀银新工艺的镀液与镀层性能接近或优于氰化镀银层。A new process of cyanide-free silver electroplating for industrial application was introduced in this paper. Performances of the plating bath, such as stability, throwing power and covering power were determined by series of tests and characterization methods;appearance quality, microstrueture, adhesion, solderability, anti-tarnish properties and electrical conductivity of the cyanide-free silver plated coating were analyzed and compared with that of conventional cyanide silver plated coating. Results showed that the properties of plating bath and coating of the new cyanide-free silver plating process were close to or better than those of traditional cyanide silver plating process.

关 键 词：无氰镀银 产业化应用 氰化镀银 镀层性能 

分 类 号：TQ153.16[化学工程—电化学工业]