等温容器充气时截面铜丝分布的拓扑优化研究  

Study on Topology Optimization for the Copper Wire Distribution of Isothermal Chamber Section During Inflating

作　　者：杨丽红[1] 刘晨中 

机构地区：[1]上海理工大学机械工程学院,上海200093

出　　处：《电子科技》2017年第3期65-69,共5页Electronic Science and Technology

基　　金：国家自然科学基金资助项目(51245009);上海市自然科学基金资助项目(12ZR1420600)

摘　　要：以等温容器截面为研究对象,截面铜丝看作多孔介质,采用拓扑优化方法优化铜丝分布,强化充气过程中容器中心向容器壁的导热。选用变密度法材料插值模型,基于弹性体结构拓扑优化模型和热力学知识,推导建立基于变密度法的散热体结构拓扑优化数学模型。以改进的网格灵敏度过滤技术等用于解决优化中的数值不稳定现象,运用Matlab编程得到容器截面铜丝分布的拓扑优化模型。并在初始温度20℃,中心边界200℃加热的情况下,经过200 s,通过与均匀填充和二层变密度填充模型的瞬态导热仿真对比,得出拓扑优化模型的导热效果更佳。研究结果表明,经过拓扑优化后的填充模型可强化等温容器充气过程中由中心向周围的传热。With isothermal chamber section as the research object, the copper wire section is considered porous media, optimizing the distribution of copper wire with topology optimization to strengthen conduction of the chamber center to the chamber wall during inflating. Above all, selecting the variable density method interpolation model, set- ting up heat dissipation structure topology optimization mathematical model based on the variable density method by the elastic body structure topology optimization model and the knowledge of thermodynamics. Secondly, the improved mesh sensitivity filtering technology is used to solve the numerical instability phenomenon of optimization, topology op- timization model of the copper wire distribution of chamber section can be gotten by using Matlab programming. Final- ly, on the condition of the initial temperature of 20 ~C, heating center boundary of 200 ~C and through 200 s, heat con- duction effect of topology optimization model is better by contrast of transient simulation of thermal conductivity with uniform filling and filling model of two - layer variable density. Research results show that the topology optimization filling model can be used to strengthen the heat conduction from the center to the surrounding of isothermal chamber during inflating.

关 键 词：等温容器 多孔介质 强化传热 拓扑优化 变密度法 

分 类 号：TN304[电子电信—物理电子学] TP301.6[自动化与计算机技术—计算机系统结构]