垂直互连在多通道T/R组件中的应用  

Application of vertical interconnection in multichannel T/R Module

作　　者：朱文举[1] 陈娜[1] 

机构地区：[1]中国电子科技集团公司第十三研究所,河北石家庄050051

出　　处：《雷达与对抗》2017年第1期42-44,共3页Radar & ECM

摘　　要：垂直互连在多通道T/R组件中应用广泛。通过仿真软件CST建立模型进行仿真,通过理论分析,优化参数,得到最佳的结构尺寸和微带匹配参数,并根据仿真结果加工实物,验证仿真结果的可靠性。测试结果表明,优化后的垂直互连适用于6~18 GHz的射频信号传输,根据需要可以优化结构并将其工作频率提高到30 GHz以上。Vertical interconnection is widely used in the multichannel T / R module. The simulation software CST is used to create a model,and the optimal structure dimensions and the parameters of the microstrip are obtained through the theoretical analysis and parameter optimization. According to the simulation result,a module is manufactured to verify its reliability. Test results indicate that the optimized vertical interconnection can be used to transmit the RF signals of 6 - 18 GHz. According to the requirements,the structure can be optimized,and the operating frequency can be increased to over 30 GHz.

关 键 词：T/R组件 垂直互连 多通道 

分 类 号：TN817[电子电信—信息与通信工程]