Cu含量对Ti-Al-Si-Cu-N纳米复合涂层微观结构和高温氧化行为的影响（英文）  

Effects of Cu Content on Microstructure and HighTemperature Oxidation Behavior of Ti-Al-Si-Cu-N Nanocomposite Films

作　　者：冯长杰[1] 陈恩[1] 李明升[2] 吴娜梅 

机构地区：[1]南昌航空大学,江西南昌330063 [2]江西科技师范大学江西省表面工程重点实验室,江西南昌330013

出　　处：《稀有金属材料与工程》2017年第3期627-633,共7页Rare Metal Materials and Engineering

基　　金：National Natural Science Foundation of China(51365041,51005111)

摘　　要：通过磁控溅射技术,在AISI-304不锈钢表面制备了不同Cu含量的Ti-Al-Si-Cu-N纳米复合涂层。通过扫描电镜(SEM)、能谱(EDS)仪、X射线衍射(XRD)仪、纳米压痕仪和自制压痕仪等设备研究Ti-Al-Si-N和Ti-Al-Si-Cu-N纳米复合涂层的结构和在800℃氧化的行为。结果表明:随着涂层中Cu含量的增加,涂层表面的微孔数量减少,涂层更加致密,涂层晶粒尺寸减小,择优取向由(111)向(110)逐渐转变。涂层的硬度由14.76 GPa增加至19.42 GPa。Cu含量为1.72%(原子分数)的Ti-Al-Si-Cu-N弹性模量最小,为104.5GPa。Cu元素对Ti-Al-Si-Cu-N纳米复合涂层抗氧化性能有两方面的影响:一是促进Al元素的扩散,二是在氧化膜表面形成裂纹和微孔缺陷。Ti-Al-Si-N涂层比Ti-Al-Si-Cu-N涂层具有更好的抗氧化性能。Ti-Al-Si-Cu-N nanocomposite films with different Cu contents were deposited on AISI-304 stainless steel by DC reactive magnetron sputtering. Both Ti-Al-Si-N and Ti-Al-Si-Cu-N nanocomposite films were oxidized at 800 °C to investigate the influence of Cu content on the microstructure and high temperature oxidation resistance by scanning electron microscope（SEM）, energy disperse spectroscopy（EDS）, X-ray diffraction（XRD）, nanoindentation tester and a home-made indentation system. The results indicate that with the increasing copper content in the films, the micropores disappear on the surface of Ti-Al-Si-N nanocomposite film and compact films are obtained. A reduction of the grain size and a change of the（111） preferred orientation to（110） are observed. The microhardness of films increases from 14.76 GPa to 19.42 GPa. The elasticity modulus of Ti-Al-Si-Cu-N films with 1.72 at% Cu content is the minimum of 104.5 GPa. The incorporation of copper at high temperature influences the oxidation resistance of the Ti-Al-Si-N films in the two aspects, one is advancing the diffusion rate of Al element, and the other is inducing cracks of oxide layer and micropores. Ti-Al-Si-N films have a better oxidation resistance than that of the films added Cu element.

关 键 词：反应磁控溅射 Ti-Al-Si-Cu-N涂层 微观结构 抗高温氧化性能 

分 类 号：TG174.4[金属学及工艺—金属表面处理]