磁控溅射沉积Cu-W膜的结构及性能研究  

Structure and Performance of Cu-W Film Prepared by Magnetron Sputtering Deposition

作　　者：艾永平[1,2] 杜晟连[1] AI Yong-ping DU Sheng-lian(New Low-Carbon Green Building Materials Institute, Building Engineering College, Jinggangshan University, Ji＇an 343009, China Beth Israel Deaconess Medical Center and Harvard Medical School, Boston 02215, USA)

机构地区：[1]井冈山大学建工学院新型低碳环保建材研究所,江西吉安343009 [2]哈佛大学医学院贝斯以色列女执事医学中心,波士顿马萨诸塞州02215

出　　处：《材料保护》2017年第3期16-18,37,共4页Materials Protection

基　　金：国家自然科学基金(81260230);国家自然科学基金(31560266);江西省星火计划(20151BBF61076);江西省科技支撑计划重大专项(20152ACG7017);江西省科技成果重点转移转化计划(20151BBI90035);江西省普通本科高校中青年教师发展计划访问学者专项资金项目资助

摘　　要：为得到最佳性能的磁控溅射Cu-W薄膜,采用磁控溅射技术在玻璃片上沉积Cu-W单层膜。采用电子探针测试薄膜中W含量,采用X射线衍射仪、扫描电镜、硬度仪、凹抗仪、分析膜层物相、形貌及耐磨性。研究了W含量对Cu-W薄膜显微结构和性能的影响。结果表明,在沉积过程中W对Cu-W薄膜的晶粒大小及沉积速率有重要影响:随W含量的增加,Cu-W薄膜的晶粒尺寸减少,薄膜的沉积速率随之减少,薄膜W含量对膜的硬度、耐磨性能也起着关键作用;当W含量在11.1%时,Cu-W薄膜具有最好的硬度和耐磨性。Cu-W films were deposited on glass sheet by magnetron sputtering. The electron microprobe was used to study the W content of films, and X-ray diffraction, scanning electron microscope, hardness meter and concave resistance instrument were employed to analyze the phase, morphology and wearability of films. Meanwhile, the influences of W content on the microstructure and performance of Cu-W films were studied. Results showed that during the deposition process, W affected the grain sizes of Cu-W films and the deposition rate significantly. As the W content increased, grain size of the Cu-W film decreased, and the deposition rate reduced as well. Besides, the W content possessed key influences on the hardness and wearability of films. When the W content was 11.1%, the Cu-W film had the optimal hardness and wearability.

关 键 词：Cu-W薄膜 磁控溅射 结构 耐磨性 

分 类 号：TB383.2[一般工业技术—材料科学与工程]