冷热冲击对无铅钎料可靠性的影响  

Effect of thermal shock on lead-free solder reliability

作　　者：王健[1,2] 刘洋[1] 张洪武[1] 孙凤莲[1] 

机构地区：[1]哈尔滨理工大学材料科学与工程学院,哈尔滨150040 [2]上海航天通讯设备研究所,上海201109

出　　处：《焊接学报》2017年第3期91-94,共4页Transactions of The China Welding Institution

基　　金：国家自然科学基金资助项目(51174069)

摘　　要：文中对比了一种新型低银钎料Sn-Ag-Cu-Bi-Ni(SACBN07)与市场上的SAC305,SAC0307两种无铅钎料的抗冷热冲击性能.利用纳米压痕试验等微观测试方法研究时效后界面组织及力学性能的变化.结果表明,SACBN07的抗冷热冲击性能最好,焊点失效后三种材料中裂纹的扩展路径不同,SAC305失效裂纹位于体钎料中,SACBN07钎料断裂位置逐渐由钎料基体转移到金属间化合物(IMC)层中,而SAC0307断裂位于界面IMC中;钎料中Bi,Ni元素的加入有效地抑制了IMC的生长,相同冷热冲击时间,SACBN07钎料中界面IMC厚度最薄;SACBN07体钎料的硬度受冷热冲击影响最小,时效后仅降低了8.6%,而SAC305与SAC0307分别降低了12.5%和28.3%.The thermal shock resistance test of Sn-Ag-CuBi-Ni(SACBN07),SAC305 and SAC0307 was conducted and compared in this study.The intermetallic compounds microstructure(IMC) and the mechanical properties of aged solder were investigated using nano-indentation and scanning electron microscopy.Results indicated that SACBN07 showed the best thermal shock resistance compared to the other two solder.The three types of solder exhibited different crack propagation paths during thermal shock test.The crack initiated and propagated in the bulk SAC305 solder.In the case of SACBN07,the crack propagated from the bulk solder to IMC layer.While the crack in SAC0307 was observed between IMC and copper pad.In addition,the addition of Bi and Ni elements into Sn Ag Cu solder effectively suppresses the IMC growth.Under the same test condition,the layer thickness of IMCs for SACBN07 was the thinnest in the three solders.The hardness variation of SACBN07 subjected to thermal shock loading was the most slight.The hardness of SACBN07,SAC305 and SAC0307 decreased by 8.6%,12.5%and 28.3% respectively after thermal shock test.

关 键 词：无铅钎料 冷热疲劳 断裂模式 

分 类 号：TG425.1[金属学及工艺—焊接]