氮化硅陶瓷水下激光与超声复合加工方法及其机理研究  

Research on Ultrasonic-laser Machining Underwater and Its Mechanism for Silicon Nitride Ceramics

作　　者：姚燕生[1] 袁珠珠 王园园[1] 陈雪辉[1] 袁根福[1,2] 

机构地区：[1]安徽建筑大学机械与电气工程学院,合肥230022 [2]江南大学机械工程学院,无锡214122

出　　处：《机械工程学报》2017年第7期207-216,共10页Journal of Mechanical Engineering

基　　金：国家自然科学基金(511752290);安徽省自然科学基金(1208085ME79);安徽省高校自然科学研究(KJ2015A013;KJ2015A050)资助项目

摘　　要：陶瓷材料具有强度高、硬度大、耐高温、耐腐蚀、耐磨损等优点,但同时也具有难加工的缺点。研究水下激光去除材料的热学模型与氮化硅水解反应,建立水流辅助超声与激光复合加工试验装置,分别开展不同条件、不同参数下对氮化硅的刻槽加工试验,并采用影像仪和电子显微镜对刻槽深度与表面质量观测比较,应用能谱仪检测生成物成分,综合分析加工机理。研究结果表明在有水辅助激光加工氮化硅过程中,因水的冷却作用减少了激光去除材料的有效能量,刻蚀深度随之变小,但激光作用区的温升加剧氮化硅水解,同时水流带走二氧化硅等生成物,促使加工表面质量明显提高;在水下激光与超声复合加工中,超声振动加大了氮化硅表面水的对流与物质的抛出,提高了刻蚀速率。Ceramic material has the advantages of high strength, high hardness, high temperature resistance, corrosion resistance, wear resistance and so on, but also has the disadvantage of difficult processing. The thermal model of the underwater laser material removal and the hydrolysis reaction of silicon nitride are studied. Laser etching experiments on silicon nitride under different conditions and different parameters are applied by the combined device of water assisted ultrasonic-laser machining. The depth and surface quality of grooves etched are investigated by the image instrument and the electron microscope, and the composition of the product is detected by the spectrometer in order to discover the mechanism of laser combined processing. Results show that in the process of water are assisted laser machining of silicon nitride, due to the cooling effect of water reduces the effective energy of material removal, and etching depth becomes small. However, surface quality is greatly improved with water, because the zone of action of laser temperature increased hydrolysis of silicon nitride and the water jet flow away silica product. In the approach of water is assisted by ultrasonic-laser machining, ultrasonic vibration increases water convection and particle motion near the material surface, then corrosion rate is improved.

关 键 词：氮化硅 水辅助 激光与超声复合加工 机理 

分 类 号：TG4[金属学及工艺—焊接]