印制线路板上硫氰酸亚金钾体系化学镀金  

Electroless gold plating on printed circuit board in potassium gold(Ⅰ) thiocyanate bath

作　　者：陈易[1] 罗洁[1] 钟迪元 董振华 李德良[1] 

机构地区：[1]中南林业科技大学环境科学与工程学院,湖南长沙410004 [2]湖南荣伟业电子材料科技公司,湖南长沙410007 [3]东莞市道诚绝缘材料有限公司,广东东莞523505

出　　处：《电镀与涂饰》2017年第7期357-360,共4页Electroplating & Finishing

基　　金：国家自然科学基金(20976201);湖南省自然科学基金(07JJ6156);国家教委留学回国人员资助项目(2004184)

摘　　要：以硫氰酸亚金钾[KAu(SCN)_2]为金源对镀镍印制线路板进行化学镀金。采用单因素试验研究了镀液中Au^+含量、硫氰酸铵含量、pH和温度对沉金速率、金层外观和结合力的影响,得到最优配方和工艺参数为:Au^+2.0 g/L,硫氰酸铵15 g/L,添加剂Cy-808 150 mL/L,pH 3.0,温度50℃。在此条件下沉金速率约为6 nm/min,结晶均匀细致,呈光亮的金黄色。Electroless gold plating was conducted on the surface of nickel-plated printed circuit board using potassium gold（I） thiocyanate [KAu（SCN）2] as main salt. The effects of Au＋ and ammonium thiocyanate contents, as well as pH and temperature of the bath on deposition rate, appearance and adhesion of gold coating were studied by single-factor experiment. The optimal bath composition and process parameters were obtained as follows： Au＋ 2.0 g/L, ammonium thiocyanate 15 g/L, additive Cy-808 150 mL/L, temperature 50℃, and pH 3.0. The gold deposition rate under the given process conditions is ca.6 nm/min. The obtained gold coating is uniform, compact, bright and golden yellow.

关 键 词：印制线路板 化学镀金 硫氰酸亚金钾 外观 结合力 

分 类 号：TQ153.16[化学工程—电化学工业]