陶瓷基印制板  

Ceramic substrate PCB

作　　者：林金堵 

出　　处：《印制电路信息》2017年第5期47-50,共4页Printed Circuit Information

摘　　要：文章概评了陶瓷印制板的主要优点和制造方法。由于陶瓷印制板具有最好的导热性绝缘介质、很高的熔点和热的尺寸稳定性等的优势。同时,可采用传统的PCB制造技术进行生产。因此,它在PCB领域应用中将有广阔的发展前景。This paper described the advantages and manufacturing process of ceramic substrate PCB. Ceramic PCB has the best thermal conductivity, high melting point and thermal dimensional stability. Meanwhile, it can be produced by traditional process. Therefore it has broad application in many fields.

关 键 词：陶瓷基板 高导热率(系数) 高温化领域 尺寸稳定性 

分 类 号：TN41[电子电信—微电子学与固体电子学]