大功率半导体激光器有源区温度影响因素分析  

Analysis on influencing factors of active region temperature of high power semiconductor laser module

作　　者：杨宏宇[1] 刘林 舒世立[3] 乔岩欣[1] 邵勇[1] 石凤健[1] 

机构地区：[1]江苏科技大学先进焊接技术省重点实验室,镇江212003 [2]森萨塔科技有限公司,常州213000 [3]中国科学院长春光学精密机械与物理研究所发光学及应用国家重点实验室,长春130033

出　　处：《江苏科技大学学报（自然科学版）》2017年第2期143-147,共5页Journal of Jiangsu University of Science and Technology:Natural Science Edition

基　　金：国家青年科学基金资助项目(51501176);吉林省青年科研基金资助项目(20140520127JH);国家国际科技合作专项资助项目(2013DFR00730)

摘　　要：为了提高大功率半导体激光器模块散热性能,文中数值模拟研究了激光器模块的温度场,分析了焊料导热系数及其厚度、热沉导热系数和半导体制冷器冷面温度对芯片有源区温度及模块散热性能的影响规律.结果表明:焊料厚度在2~24μm范围内,无高阻层形成,模块散热性能稳定,而当焊料厚度大于24μm后,有源区温度迅速升高;随着热沉导热系数的增加,有源区温度呈指数形式下降,且当其导热系数小于1200 W/m·K时,温度降低更显著;半导体制冷器冷面温度与有源区温度呈比例系数为1的线性关系.In order to improve the heat dissipation performance of high power semiconductor laser module,the temperature field of high power semiconductor laser module was studied through the numerical simulation analysis in this paper. The effects of solder parameters,thermal conductivity of heat sink,cold face temperature of thermoelectric cooler（ TEC） on the temperature of active region and the heat dissipation performance of the laser module were analyzed. The results showed that when the solder thickness was less than 24 μm,there was no high resistance layer formed and the heat dissipation performance of the laser module was stable. When the solder thickness was more than 24 μm,the temperature of active region increased rapidly. The temperature of active region decreased in an exponential form with the increase of the thermal conductivity of heat sink. Moreover,when the thermal conductivity of heat sink was less than 1200 W/m·K,the temperature of active region decreased more obviously. The relationship between the cold face temperature of TEC and the temperature of active region exhibited linear correlation with the proportional coefficient equal to1.

关 键 词：大功率半导体激光器 温度分布 焊料 热沉 半导体制冷器 

分 类 号：TN248.4[电子电信—物理电子学]