铜/钨铜/铜热沉复合材料界面结合性能的研究  

Research on Interface Bonding Performance of Cu/W-Cu/Cu Heat Sink Composite Material

作　　者：张帅[1] 姜国圣[1] 王志法[1] 李杰[1] 

机构地区：[1]中南大学材料科学与工程学院,湖南长沙410083

出　　处：《稀有金属与硬质合金》2017年第2期36-38,80,共4页Rare Metals and Cemented Carbides

摘　　要：采用扩散焊接工艺制备铜/钨铜/铜热沉复合材料,研究了焊接温度、保温时间、焊接压强对焊接界面结合强度和界面扩散的影响,当焊接温度为980℃、保温时间为4h、压强为55MPa时,铜/钨铜/铜热沉复合材料的界面结合强度最大,说明此时扩散复合的效果最好,焊接接头质量最高。Cu/W-Cu/Cu heat sink composite material was prepared by diffusion welding process. The effects were investigated of welding temperature, heat preservation time, and welding pressure on welding inter- face bonding strength and interracial diffusion. When welding temperature is 980 ℃ ,heat preservation time is 4 h and welding pressure is 55 MPa,Cu/W-Cu/Cu interface bonding strength is the maximum,indicating the best effect of diffusion welding and the highest quality of welded joints.

关 键 词：钨铜 复合材料 扩散焊接 界面结合强度 界面扩散 

分 类 号：TB331[一般工业技术—材料科学与工程]