Sn-Bi系低温无Pb焊料的研究现状及发展趋势  

Review of Sn-Bi Low Temperature Lead-free Solder

作　　者：陈剑明[1] 张建波[2] 李明茂[2] 

机构地区：[1]江西理工大学材料科学与工程学院,江西赣州341000 [2]江西理工大学工程研究院,江西赣州341000

出　　处：《有色金属材料与工程》2017年第2期112-118,共7页Nonferrous Metal Materials and Engineering

基　　金：江西省科技自然科学基金项目(20142BAB206013)

摘　　要：低熔点Sn-Bi焊料是比较有发展潜力的低温无Pb焊料.根据Sn-Bi焊料的特性及其应用存在的问题,结合近几年国内外对Sn-Bi系低温无Pb焊料的最新研究成果,综述了Sn-Bi无Pb焊料的温度诱导熔体结构转变现象及其对Sn-Bi焊料凝固组织的影响,介绍了合金元素及稀土元素的添加对Sn-Bi焊料润湿性能的影响及其影响机制,并分类总结了不同元素对Sn-Bi焊料与Cu基体界面化合物生长的促进与抑制作用及其原理,最后综合评述Sn-Bi低温无Pb焊料存在的问题,对Sn-Bi焊料的发展趋势进行了展望.With low melting point, Sn-Bi solder has a prospective application as low temperature lead-free solder. This paper reviews the phenomenon of the temperature induced melting structure transition in Sn-Bi lead-free solder and its effect on solidified microstructure of Sn-Bi solder. This work is based on the characteristics and issues in application of Sn-Bi solder, combing with recent research in Sn-Bi low-temperature solder field at home and abroad. Firstly, the effect of alloy element and rare earth element on wetting property of Sn-Bi solder and the related mechanism were introduced. Secondly, the enhancement or degradation of interfacial compounds growth of Sn- Bi solder and Cu substrate by using different element were classified and summarized. Finally, we comprehensively analyzed the existing challenge on Sn-Bi low temperature lead-free solder and also outlooked the prospect of development trend in Sn-Bi solder.

关 键 词：Sn—Bi焊料 无Pb焊料 结构转变 润湿性能 界面化合物 

分 类 号：TG42[金属学及工艺—焊接]