硅片真空键合设备研制  

Development of Silicon Wafer Vacuum Bonding Equipment

作　　者：李安华[1] 

机构地区：[1]中国电子科技集团公司第二研究所,山西太原030024

出　　处：《装备制造技术》2017年第5期159-161,173,共4页Equipment Manufacturing Technology

摘　　要：为了将硅片与硅片有效的键合在一起,研发了一款硅片键合设备。介绍了硅片键合原理及硅片真空键合设备的主要技术指标、设备结构、控制系统等。The paper is aimed at the effective bonding between silicon wafer and silicon wafer, so the device of the silicon bonding was developed. In this paper, the principle of silicon bonding and the main technical specifi- cations, equipment structure and control system of silicon slice vacuum bonding equipment are introduced.

关 键 词：硅片键合 真空 加压 加热 

分 类 号：TB79[一般工业技术—真空技术]