微波组件内引线常见键合故障分析及预防措施  

Failures Analysis and Preventive Measure of Wire Bonding of Microwave Multichip Module

作　　者：戴久宏 

机构地区：[1]中国电子科技集团公司第五十五研究所,江苏南京210016

出　　处：《电子工艺技术》2017年第3期159-163,共5页Electronics Process Technology

摘　　要：微波组件组装中,经常出现内引线键合系统的缺陷。一些缺陷在某种条件下可导致产品失效。研究了内引线键合的缺陷和失效问题,分辩其失效模式和失效机理,确定其最终的失效原因,提出了改进设计和制造工艺的建议。采取有效质量管理措施后,消除了故障隐患,提高了产品可靠性。The defects of wire bonding often appear during assembly process of microwave multichip module. Some defects under certain conductions can lead to product failures. The defects and failures of the wire bonding were analyzed. The final failure reason was found by identifying the failure mode and failure mechanism. Some suggestions of design and manufacturing process were proposed. The defects were eliminated and the product reliability was improved after taking effective quality control measures.

关 键 词：微波组件 引线键合 失效分析 预防措施 

分 类 号：TN605[电子电信—电路与系统]