氧化铜掺杂对电阻浆料性能的影响  

Effect of CuO doping on properties of resistor paste

作　　者：李程峰 张秀 杜玉龙 徐泽鹏 冉铧深 

机构地区：[1]中国振华集团云科电子有限公司,贵州贵阳550018

出　　处：《电子元件与材料》2017年第7期39-42,共4页Electronic Components And Materials

基　　金：贵州科技合作项目(No.GZ字[2015]3005)

摘　　要：以氧化钌为电阻浆料原料,研究了不同粒度氧化铜掺杂对电阻浆料性能的影响。分别以两种不同粒度分布的氧化铜对电阻浆料进行掺杂,研究了掺杂前后电阻浆料印刷膜层电性能的影响。结果表明掺杂氧化铜能够使电阻浆料的方阻值大幅度降低,同时使电阻温度系数向正方向变化,不同粒度分布的氧化铜对电阻浆料电性能影响的趋势相同,但超细纳米级氧化铜对电阻浆料电性能的影响更为显著,能够更有效地调节电阻浆料的方阻及电阻温度系数等参数。Using ruthenium oxide powder as the raw material, and copper oxides with different particle sizes as dopant, the resistor pastes were produced, and the electrical properties of resistor pastes were studied. The results show that resistance could be reduced largely by copper oxide doping, and the TCR （temperature coefficient of resistance） shifts positively. Different resistor pastes have the same variation trend when doped with copper oxide. The paste doped with nano-copper oxide has more obvious change, so the nano-copper oxide doping could adjust the resistance and TCR of paste more effectively.

关 键 词：氧化钌 电阻浆料 掺杂 方阻 电阻温度系数 氧化铜 

分 类 号：TM241[一般工业技术—材料科学与工程]