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出 处:《半导体光电》2017年第3期355-360,共6页Semiconductor Optoelectronics
基 金:国家自然科学基金项目(51365021)
摘 要:为提高平面光学元件的加工质量和效率,理解元件与抛光盘之间的相对运动轨迹变化规律是获得良好表面质量的重要前提。根据"运动学原理"和"坐标变换"建立了磨粒运动轨迹模型,推导了磨粒轨迹长度公式。利用Matlab软件模拟计算了各参数下的磨粒轨迹长度和磨粒轨迹变化形态。研究表明:不同转速比对材料去除速率和表面质量影响显著;随着磨粒径向距离和偏心距的增大,磨粒轨迹长度增加,考虑到偏心距对工件表面质量的影响,偏心距不宜太大或太小;同一转速比下,不同的磨粒初始角度对磨粒轨迹形状没有影响,只会使其转过相应角度。In order to improve the machining quality and efficiency of the plane optical elements,understanding the change rules of the relative motion trajectory between the component and the polishing disc is an important prerequisite for obtaining good surface quality.The abrasive particle motion trajectory model is established and the formula of grinding particle track length is derived according to the principle of kinematics and the coordinate transformation.The length of the grinding particle track and the morphology change of trajectory under various parameters are calculated and simulated by using Matlab software.The result shows that the material removal rate and surface quality were significantly affected by different rotational speed ratio and the abrasive grain trajectory length increases with the increase of the radial distance and the eccentricity of the abrasive grains,the eccentric distance should not be too large or too small in view of the fact that the influence of eccentricity on the surface quality of the workpiece.Meanwhile,the initial angle of different abrasive grains has no influence on the shape of the particle trajectory and just around the corresponding angle under the same rotating speed ratio.
分 类 号:TN305.1[电子电信—物理电子学]
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