基于OpenCV的硅片盒中硅片层级分布定位检测方法  

Detection of Silicon Wafer Level Distribution Based on OpenCV in Silicon Wafer Box

作　　者：刘志峰[1] 文俊武 蔡力钢[1] 陈国英[2] 王倩蕾[2] 杨聪彬[1] 

机构地区：[1]北京工业大学先进制造技术北京市重点实验室,北京100124 [2]北京工业大学科学发展院,北京100124

出　　处：《北京工业大学学报》2017年第7期996-1002,共7页Journal of Beijing University of Technology

基　　金：北京市科技计划重大项目(D17110400590000);国家自然科学基金资助项目(51575009);北京市自然科学基金资助项目(3162003);北京工业大学"智能制造领域大科研推进计划"资助项目

摘　　要：为了解决硅片厚度在0.1 mm以下时,激光传感器扫描检测容易发生硅片漏扫的问题,提出一种基于OpenCV的硅片层级分布定位检测方法,利用图像预处理技术得到各层级硅片前边缘轮廓样本库,将测试图像的边缘轮廓与样本库中的图像依次做差值运算,从而通过像素点总和是否达到规定阈值来判定该层是否存在硅片,从而达到硅片层级分布定位检测的目的.结果表明:该方法能够有效提高硅片盒中0.1 mm以下硅片层级分布定位检测的可靠性,且算法简单,实时性及兼容性较好.To solve the problem that the silicon chip leak detection is easy to occur due to the thickness of the silicon chip below 0. 1 mm. In this paper, a method for positioning detection of wafer level distribution was proposed based on OpenCV. The front edge profile of the wafer sample image was obtained by using the image preprocessing technology. The difference between the edge profile of the test image and the image in the sample library was calculated to determine whether the silicon layer existed in the silicon layer by the sum of the pixel points to reach the prescribed threshold value, and then positioning detection of the silicon wafer level distribution was achieved. The results show that the proposed method can effectively improve the re lia b i l ity of positioning detection of the silicon wafer level distribution when silicon wafer with thickness is less than 0. 1 mm,and the algorithm is simple, real-time and compatible.

关 键 词：OPENCV 硅片传输 定位检测 视觉检测 

分 类 号：TP242[自动化与计算机技术—检测技术与自动化装置]