激光焊接在超微矩形电连接器微组装领域的应用  

Application on Micropackage by Laser Soldering of Nanominiature Rectangular Electrical Connector

作　　者：曹锦珠[1] 朱茗[1] 成慧[1] 

机构地区：[1]中国电子技术标准化研究院

出　　处：《信息技术与标准化》2017年第6期74-77,共4页Information Technology & Standardization

摘　　要：通过分析超微矩形电连接器技术与标准,发现传统焊接方式对超微矩形电连接器造成制约、需针对超微矩形电连接器焊接试验方法在详细规范中做出相应的要求和规定。并对超微矩形电连接器电装回流焊和激光焊进行对比分析,研究表明激光焊接在焊接尺寸、精度、强度、效率和热影响区域等方面都存在较大优势,展望了激光焊接在微组装领域的发展趋势。The limitation of traditional soldering for nanominiature rectangular electrical connector （NREC） is exhibited by analyzing the standard and technology of NREC, and the soldering experimential methods for NREC need to be required and specified in the detail specification. Moreover, the advantages of laser soldering, for example, weld size, accuracy, intensity, efficiency and heat-effect-zone, are demonstrated by comparing the reflow soldering in the field of electric fitting. Finally, the research significance and the future development of laser soldering for micropackage is demonstrated in this essay.

关 键 词：激光焊接 超微矩形电连接器 电子元器件 微组装 

分 类 号：TM503.5[电气工程—电器]