一种新型柱形POP堆叠封装的信号完整性研究  

Study of Signal Integrity for A Novel Stacked Cylindrical PoP

作　　者：邢志强[1] 

机构地区：[1]中国电子科技集团公司第二十研究所,陕西西安710068

出　　处：《电子测试》2017年第7期39-40,38,共3页Electronic Test

摘　　要：多层Package-on-Package(POP)堆叠封装技术因具有良好的灵活性与扩展性,广泛应用于数字电子产品的制造中。同时,信号在3D集成封装中的速度不断提高,要求封装互连结构具有良好的信号完整性。本文基于一种新型柱形POP封装结构,通过仿真分析工具建立等效模型,分析相邻两层芯片间信号传输过程中噪声干扰对信号的影响以及提高信号质量的方法。对比在不同高度和半径情况下,柱形POP堆叠结构与传统POP堆叠结构上的信号传输质量,证明前者在信号完整性方面的优越性。The multilayer Package-on-Package（POP） stacking technique is widely applied in the area of portable electronics, which has better flexibility and expansibility. Meanwhile, the signal speed in 3D integration packages increases continuously, which requires package interconnect structure to have good signal integrity. In this paper, based on a novel stacked cylindrical POP package structure, a design about the noise interference problem of signal transmission between the neighboring layers of chip and the approach to improve signal quality is present by building equivalent models. In the different height and radius cases, a comparison between cylindrical POP package and traditional POP package indicates that the former has a superiority on signal integrity.

关 键 词：堆叠 POP封装 信号完整性 

分 类 号：TN405[电子电信—微电子学与固体电子学]