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作 者:王永珍[1,2] 何岳山[2] 杨中强[2] 苏晓声[2] 容敏智[1]
机构地区:[1]中山大学化学学院聚合物复合材料及功能材料教育部重点实验室,广州510275 [2]广东生益科技股份有限公司国家电子电路基材工程技术研究中心,广东东莞523039
出 处:《绝缘材料》2017年第7期19-25,共7页Insulating Materials
基 金:广东生益科技股份有限公司博士后科研工作站资助项目(SYL-150613)
摘 要:采用六-(4-醛基-苯氧基)环三磷腈(HAP)与9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物(DOPO)在溶液体系中亲核加成制备六-(磷杂菲-羟甲基-苯氧基)-环三磷腈(HPHMPC)阻燃剂,以此为添加型阻燃剂加入到环氧树脂体系中制备高玻璃化转变温度(T_g)的玻璃纤维基层压板。考察了阻燃剂含量对板材阻燃、耐热、介电等性能及剥离强度的影响。结果表明:阻燃剂HPHMPC与环氧树脂具有很好的相容性,能有效地阻燃玻璃纤维布基环氧板材,当板材树脂中HPHMPC阻燃剂含量为19.2%时,板材的阻燃等级达到UL 94 V-0级,T_g为194.6℃,并具有较高的热稳定性和较低的热膨胀系数。A hexa-(phosphaphenanthrene-hydroxymethyl-phenoxyl)-cyclotriphosphazene (HPHMPC) flame retardant was synthesized by nucleophilic addition reaction in solution system from hexakis(4-formacylphe- noxy)cyclotriphosphazene (HAP) and 9,10-Dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO). Fiber- glass based copper clad laminates (CCLs) with high glass transition temperature (Tg) were prepared by adding the HPHMPC to epoxy resin as additive flame retardant. The effects of flame retardant content on the flame retardancy, heat resistance, dielectric properties, and peel strength of the CCLs were stud- ied. The results show that the HPHMPC has good compatibility with epoxy resin, and it has good flame retardant effects on the CCLs. When the HPHMPC content in CCLs is 19.2%, the flame retardant rate of the CCLs reaches UL 94 V-0 level, the Tg is 194.6 ℃, and the CCLs have good thermal stability and low coefficient of thermal expansion.
关 键 词:六-(磷杂菲-羟甲基-苯氧基)-环三磷腈 覆铜板 阻燃性能 玻璃化转变温度
分 类 号:TM215.1[一般工业技术—材料科学与工程]
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