晶圆激光切割技术的研究进展  

Research Progress on Wafer Laser Cutting Technology

作　　者：李海鸥[1] 韦春荣[1] 王晓峰[2,3] 张紫辰[2,4] 潘岭峰[2] 李琦[1] 陈永和[1] 

机构地区：[1]桂林电子科技大学广西精密导航技术与应用重点实验室,广西桂林541004 [2]中国科学院微电子研究所微电子设备技术研究室,北京100029 [3]中国科学院半导体研究所,北京100083 [4]清华大学精密仪器系微纳制造器件与系统协同创新中心精密测试技术及仪器国家重点实验室,北京100084

出　　处：《半导体技术》2017年第8期561-568,共8页Semiconductor Technology

基　　金：国家自然科学基金资助项目(61376083;61474031);广西自然科学基金资助项目(2016GXNSFDA380021);广西十百千人才工程资助项目;中国科学院装备研制项目;中国科学院微电子器件与集成技术重点实验室资助项目;射频电路与系统教育部重点实验室(杭州电子科技大学)资助项目

摘　　要：综述了半导体领域晶圆切割技术的发展进程,介绍了刀片切割技术、传统激光切割技术、新型激光切割技术及整形激光切割技术的特点、工作原理和优缺点以及国内外使用晶圆切割技术获得的研究成果及其应用前景。与刀片切割技术相比,激光切割技术具有切割质量好、切割速度快等优点。详细介绍了以进一步改善晶圆切割质量和提高切割速度为目的的几类整形激光切割技术,包括微水导激光切割技术、隐形切割技术、多焦点光束切割、"线聚焦"切割、平顶光束切割和多光束切割等。随着技术的不断完善、切割设备的不断成熟,整形激光切割技术在未来的晶圆切割领域将具有广阔的应用前景。The development process of the wafer cutting technology in semiconductor field is summarized. The characteristics,working principles,advantages and disadvantages of some cutting technologies are introduced,such as blade cutting technology,traditional laser cutting technology,new laser cutting technology and shaping laser cutting technology. The research results obtained by using the wafer cutting technology at home and abroad and its application prospects are also introduced. Comparing with the blade cutting technology,the laser cutting technology has the advantages of good cutting quality and fast cutting speed and so on. Several types of shaping laser cutting techniques,including micro-water guided laser cutting technology,stealth cutting technology,multifocal beam cutting, ＂line focusing＂cutting,flat-top beam cutting and multi-beam cutting to further improve the quality of wafer cutting andthe cutting speed are introduced in detail. With the continuous improvement of technology and cutting equipment,shaping laser cutting technology will have a broad application prospect in the future wafer cutting field.

关 键 词：刀片切割 激光切割 切割速度 切割质量 整形激光 

分 类 号：TN305.1[电子电信—物理电子学] TG485[金属学及工艺—焊接]